Packaging Technology Development Engineer, Components Research, Intel
Sasha Oster works at Intel Corporation as a Packaging Technology Development Engineer in Components Research, the research arm of Intel’s manufacturing division, located in Chandler, AZ. She specializes in millimeter wave research, development, and measurements. Previously at Intel, Sasha worked with the Silicon Photonics Operation as an Optical R&D Engineer and the Test Technology Development team as Test R&D engineer as part of Intel’s Rotation Engineer Program. Sasha received her Ph.D. in Electrical Engineering from Iowa State University.