Title: Advanced Glass and Multilayer Polymer Substrates for multi Gigabit/s Wireless Modules
Speaker: Telesphor Kamgaing, Principal Research Engineer, Intel Corporation
Abstract: The ISM frequency band around 60 GHz presents a huge opportunity for short range wireless communication with datarate in the order of several Gigabits per second (Gbps). Those data rates are key enablers for applications such as wireless docking, wireless sync-and-go, rapid video downloading, and the display/streaming of uncompressed high definition video. Radio circuits such as amplifiers have the disadvantage that the output power of typical CMOS transistors drops significantly with increasing frequency; hence, it’s necessary to combine several amplifiers in a phased array to create signal beams with decent strengths. The CMOS phased array transceiver is supported by antennas that are implemented on a package substrate. Given the low gain of mm-wave on-chip power- and low-noise-amplifiers and the high signal attenuation associated with on-chip interconnects, it’s critical that the package exhibit low routing losses and deliver antennas with very high efficiency. This requires a proper combination of material selection, antenna design, substrate design and fabrication. This presentation will discuss some organic and non-organic low loss dielectric material that may be suitable for use at millimeter wave frequencies. In the first part of the presentation, we investigate photodefinable glass both in terms of processing and suitability for mm-wave frequencies. Test structures including through-glass vias, transmission lines and microstrip patch antennas on glass have been fabricated and fully characterized up to 67 GHz. In the second part of the presentation, we will discuss functional phased array modules implemented on multilayer liquid crystal polymer (LCP) substrates as well as techniques to improve antenna performance on thin microelectronic package substrates.
Speaker Bio: Telesphor Kamgaing is currently a Principal Research Engineer with the Components Research Group of Intel Corporation, where his work focuses on disruptive packaging solutions for on- and off-chip radio integration, system-on-chip integration, radio coexistence on ultra-small form factor platforms and millimeter wave applications. He joined Intel in 2004 after a brief stay as guest researcher with the National Institute of Standards and Technology and four years as a Device Design Engineer with the Digital DNA Labs of Motorola in Tempe, Arizona. At Intel he has previously occupied the positions of Senior Staff Research Scientist, Senior Microelectronic Packaging Engineer and Technology Development Manager. In the latter role he oversaw the electrical analysis of all radio frequency (RF) and low-density interconnect packages. He pioneered the expansion of Intel FCBGA package substrate technology to include embedded passives for RF applications. He holds a Ph.D. Degree in Electrical Engineering from the University of Maryland at College Park and a Diplom-Ingenieur Degree from Darmstadt University of Technology in Darmstadt, Germany.