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Cheng Huang

  • Assistant Professor

 

Office

2124 Coover Hall, 2520 Osborn Dr.,
Ames, IA 50011
Phone: 515-294-2722

Email: chengh@iastate.edu

 

News

Oct.
2021
PaperJunyao’s paper on capacitive isolated DC-DC is accepted in the IEEE International Solid-State Circuits Conference (ISSCC) 2022!

Well done, Junyao!
Oct.
2021
JobShuo (my 1st MS student) will join Maxim (now part of ADI) in Phoenix, AZ, starting in Jan. 2022.

Big congratulations!
Oct.
2021
PaperRizwan presented a paper in the IEEE Biomedical Circuits and Systems Conference (BioCAS) 2021.

Congrats!
Feb.
2021
ServiceDr. Huang served as a Track and session Chair for the IEEE Midwest Symposium on Circuits and Systems (MWSCAS) 2021.
Jan.
2021
ServiceDr. Huang served as a Session Chair for the IEEE International Symposium on Circuits and Systems (ISCAS) 2021.
Jan.
2021
PaperShuo‘s paper on wireless power has been accepted in IEEE International Symposium on Circuits and Systems (ISCAS) 2021!

Congrats!
Jan.
2021
JobShuo joined Skyworks in Cedar Rapid, IA, in their co-op program.

Congratulations!
Oct.
2020
PaperJunyao‘s paper on wireless power has been accepted in IEEE International Solid-State Circuits Conference (ISSCC) 2021!

Well done, Junyao!
Apr.
2020
PaperOur paper on single-inductor multiple-output converters has been published in IET Electronics Letters (EL).
Feb.
2020
PaperOur paper on switched-capacitor converters has been published in IEEE Transactions on Power Electronics (TPEL).
Jan.
2020
ServiceDr. Huang starts to serve as the Associate Editor of the IEEE Transactions on Circuits and Systems – II (TCAS-II).
Oct.
2019
ServiceDr. Huang serves on the Review Committee of IEEE International Symposium on Circuits and Systems (ISCAS) 2020.
Aug.
2019
ServiceDr. Huang serves as Publicity and Social Media co-Chair for IEEE Midwest Symposium on Circuits and Systems (MWSCAS) 2019.
Oct.
2018
ServiceDr. Huang serves on the Review Committee of IEEE International Symposium on Circuits and Systems (ISCAS) 2019.
Feb.
2018
PaperOur paper on wireless power have been published in the IEEE Journal of Solid-State Circuits (JSSC)!
Feb.
2018
PaperOur paper on 3-level buck converter have been published in the IEEE Journal of Solid-State Circuits (JSSC)!
Jan.
2018
OriginDr. Huang resigned from Broadcom, CA, to join the Iowa State University, IA.

A whole new journey!

 

Research Opportunities

I am always looking for graduate/undergraduate students to work with me. If you are interested in researches on any topic related to power management integrated circuit designs, or, just curious about what power management circuits are, what roles they play in electronics, and how they work, please do not hesitate to contact and visit me! I am more than happy to share my knowledge, from research related to experience in industry or career, with you!

 

Current Openings

PhD Students: currently filled;

MS Students: unlimited, all are welcome!

Graduate applicants are expected to be familiar with designing transistor-level circuits in Cadence.

PhD applicants with chip tape-out and measurement experience are preferred.

Undergraduate Students: currently filled, but volunteers are welcomed!

To join our lab for research, undergrad students will need to have a minimum GPA of 3.5. Students with experiences in circuit designs using Cadence, PCB layout, and FPGA and/or MCU programming are preferred.

 

Interest Areas

Various types of power management integrated circuits, including but not limited to: wireless power transfer systems, switching power regulators, energy harvesting systems, PA supply modulators, LED drivers, charge pumps and high performance linear regulators.

PI Huang’s Education

PhD, Electronic & Computer Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China (2014)

BS, Information Science & Electronic Engineering, Zhejiang University, China (2008)

PI Huang’s Biography

From 2014 to 2016, I was researching with Prof. Ishikuro-sensei’s group in Keio University, Yokohama, Japan, as a post-doctoral research scientist. During this period, I was focusing on wireless power transfer system designs for biomedical implants, and having a wonderful time traveling to different places in Japan.

From 2016 to 2017, I joined Broadcom Limited in San Jose as a full-time staff scientist, working on power management, analog and mixed-signal integrated circuits, and enjoying the beautiful sunshine in California.

From 2018, I joined as an Assistant Professor in Iowa State University, where I continue my researches on power management circuit designs and enjoy the freedom of research in the academia.

 

Highlighted Publications

  • J. Tang, L. Zhao and C. Huang, “A 68.5% Efficiency Reconfigurable 400-/800-mW Capacitive Isolated DC-DC Converter with Common-Mode Transient Immunity and Fast Dynamic Response by Through-Power-Link Hysteretic Control”, accepted in IEEE International Solid-State Circuits Conference (ISSCC) 2022, to be presented
  • J. Tang, L. Zhao and C. Huang, “A Wireless Power Transfer System with Up-to-20% Light-Load Efficiency Enhancement and Instant Dynamic Response by Fully Integrated Wireless Hysteretic Control for Bioimplants”, in IEEE International Solid-State Circuits Conference (ISSCC) 2021, pp. 470-472, Feb. 2021.
  • C. Huang, T. Kawajiri and H. Ishikuro, “A 13.56-MHz Wireless Power Transfer System with Enhanced Load-Transient Response and Efficiency by Fully-Integrated Wireless Constant-Idle-Time Control for Biomedical Implants”, IEEE Journal of Solid-State Circuits (JSSC), vol 53, no.2, pp. 538-551, Feb. 2018.
  • X. Liu, C. Huang and P. K. T. Mok, “A High-Frequency Three-Level Buck Converter With Real-Time Calibration and Wide Output Range for Fast-DVS”, IEEE Journal of Solid-State Circuits (JSSC), vol 53, no. 2, pp. 582-595, Feb. 2018.
  • C. Huang, T. Kawajiri and H. Ishikuro, “A Near-Optimum 13.56 MHz CMOS Active Rectifier with Circuit-Delay Real-Time Calibrations for High-Current Biomedical Implants”, IEEE Journal of Solid-State Circuits (JSSC), vol 51, no. 8, pp. 1797-1809,Aug. 2016.
  • C. Huang and P. K. T. Mok, “A 100 MHz 82.4% Efficiency Package-Bondwire Based Four-Phase Fully-Integrated Buck Converter with Flying Capacitor for Area Reduction”, IEEE Journal of Solid-State Circuits (JSSC), vol 48, no. 12, pp. 2977-2988, Dec. 2013.
  • C. Huang and P. K. T. Mok, “An 84.7% Efficiency 100-MHz Package Bondwire-Based Fully Integrated Buck Converter With Precise DCM Operation and Enhanced Light-Load Efficiency”, IEEE Journal of Solid-State Circuits (JSSC), vol 48, no. 11, pp. 2595-2607, Nov. 2013.
  • C. Huang and P. K. T. Mok, “An 82.4% Efficiency Package Bondwire Based Four-Phase Fully-Integrated Buck Converter with Flying Capacitor for Area Reduction”, in IEEE International Solid-State Circuits Conference (ISSCC), pp. 362-363, San Francisco, Feb. 2013.
  • J. Jiang, Y. Lu, C. Huang, W.-H. Ki and P. K. T. Mok, “A 2-/3-Phase Fully Integrated Switched-Capacitor DC-DC Converter in Bulk-CMOS for Energy-Efficient Digital Circuits With 14% Efficiency Improvement”, in IEEE International Solid-State Circuits Conference (ISSCC), pp. 366-367, San Francisco, Feb. 2015.