Tyson Stichka

Tyson Stichka
Tyson Stichka

Technical Staff Senior Member, Micron Technology, Inc.

Tyson Stichka (BSEE ’02) is a Senior Member of Technical Staff at Micron Technology. He is a senior member of the Nonvolatile Memory Product Engineering team, with responsibilities for development, validation, optimization and qualification of leading edge NAND Flash memory products, as well as integration of those components into system-level solutions.

Tyson has been with Micron since graduating from Iowa State, serving in various capacities within Nonvolatile Memory engineering. Over that time, he has played a role in Micron’s NOR and NAND Flash memory technology development through technology transitions from 180nm to 16nm and now to 3D NAND scaling. He currently manages a team focused on performance and reliability optimization and technical pathfinding for leading-edge 3D NAND Flash products. He holds two patents in the area of memory design and testing. Tyson also enjoys frequent trips back to Iowa State recruiting on behalf of Micron, and currently serves as the lead of Micron’s technical recruiting team at Iowa State.

Tyson lives in Boise, Idaho, with his wife and three young children, and he enjoys taking full advantage of the outdoor opportunities that living in the West has to offer.