Speaker: Yixiao Ding
Advisor: Chris Chu
Title: Self-Aligned Double Patterning Lithography Aware Detailed Routing with Color Pre-Assignment
Abstract: As the technology nodes scale down to sub-22nm, Double Patterning Lithography (DPL) has been considered as a practical solution for layout manufacturing. Compared with Litho-Etch-Litho-Etch (LELE), Self-Aligned Double Patterning (SADP) has better overlay control. Two types of SADP process are popularly used for the state-of-the-art lithography patterning: Spacer-Is-Dielectric (SID) and Spacer-Is-Metal (SIM). In order to have better decomposability of layout patterns, we consider SADP during detailed routing stage. The idea of color pre-assignment is adopted and a graph model is proposed which greatly simplifies the problem and reduces design rule violation. Then, the negotiated congestion based rip-up and reroute is applied to generate valid detailed routing solution. Compared with other state-of-the-art academic works, our approach does not produce any side overlay error and no design rules violation is reported. Meanwhile, a better solution in terms of total wirelength, routability, and runtime is achieved.