Title: Achieving Power Integrity through Systematic Design
Speaker: James Drewniak, Curators’ Professor, University of Missouri-Rolla
Abstract: Channels in emerging high data-rate systems have a jitter budget that is on the order of 10 ps, and power integrity (PI) is among the significant challenges impacting jitter. The usual design approach for a power distribution network (PDN) at the package and PCB levels follows best engineering practices, and, mature commercial CAD tools are available for post-layout design analysis. However, there are no proven, quantitative methodologies for developing a PDN design to meet voltage ripple and droop requirements, and design specifications are typically met through a trial-and-error process of best practices and CAD tools. A methodology has been developed for PDN design and PI analysis that can readily identify a best design for the package and PCB given typical design constraints such as BGA pitch, package stackup, package with or without decoupling, PCB stackup, and signal routing egress and ingress, among others. A method for computation and physics-based circuit extraction has been developed that is used to calculate the PDN impedance and to assess worst case voltage ripple on the PDN. If the target impedance specification is not met, the developed methodology and approach can be used to immediately identify if specifications can be achieved with design modifications within the constraints, and exactly how to do so without numerous trial-and-error simulations. The underlying physics for power integrity design will be presented and a physics-based design approach shown.
Speaker Bio: James L. Drewniak is the Curators’ Professor in the Electromagnetic Compatibility Laboratory at Missouri S&T. He received his BSEE, MSEE, and PhD from the University of Illinois at Urbana-Champaign in 1985, 1987, and 1991, respectively. His area of professional interest is Investigation of coupling physics and modeling for electromagnetic compatibility in printed and integrated circuits, electromagnetic packaging effects and signal/power integrity; EMC in power electronics and electric machinery; numerical electromagnetic analysis; antennas; and, RF, microwave, and time-domain measurements. Over the last five years, he has been funded $6.6M with a share of $1.45M from the National Science Foundation and the EMC Consortium. He has authored 90 journal/professional articles, 1 book chapter, and over 235 conference articles. He is a Fellow of the IEEE and is currently an IEEE EMC Society Distinguished Lecturer (2014-2016).